The Datacoms AIMs provides X.25 support for both Data Terminal Equipment (DTE) and Data Circuit Terminal Equipment (DCE). There are two modes of operation:

• Mode SIM: Active Link Simulation (RX, TX)
• Mode MON: Passive Link Monitoring (RX_A, RX_B)

The interface module can process up to 2Mbps of data with configurable bandwidth in both mode SIM and mode MON.

Feature Summary Line Interfaces: V.10 (up to 100Kbps) and V.11 (up to 10Mbps) DTE, DCE simulation support: V.24, V.35, V.36, X.21 Monitoring support: V.35, V.36, X.21 Full S/W configuration of the line interface (Mode SIM, Mode MON) 8 high performance HDLC (LAPD/LAPB), ASYNC, BSYNC with configurable bandwidth Non-disturbing line interface for passive monitoring (no external devices needed) CE compliant advanced design using latest manufacturing techniques

Functionality

The X.25 interface module is a four layer single-sided PCB using auto-assembly SMD technology according to ISO 9001. The X.25 physical interface is isolated from the processor sub-system and uses independent grounds to block interference.

Additional Design Features

• 32 bit embedded processor operating at 35 MIPs
• 8 MB of 32 bit wide on board DRAM
• I/O mapped buffered ISA bus transfer using hardware semaphores
• Self-test diagnostics
• Run-time software image downloaded from Host
• "Virtual Circuit" design 10.000 gates downloaded from Host
• Software and hardware updates via Internet
• "Virtual Circuit" allows customization on request